Silver-bearing oxygen-free copper
10AOFC
C10700
- High Heat Resistance & High Conductivity
Silver-bearing oxygen-free copper
C10700
Mold materials for steel manufacturing, bus bars, terminals, electrodes, and conductor components for high-current applications; electrical and electronic components used in high-temperature environments; components for brazing in hydrogen atmospheres; vacuum equipment components; heat-radiating plates; heat sinks; and heat exchangers.
A high-purity copper alloy based on oxygen-free copper (C10200) with a trace addition of silver (Ag).
It maintains electrical and thermal conductivity equivalent to oxygen-free copper while resisting softening at high temperatures.
The chemical composition of 10AOFC is as follows.
(Weight%)
| Cu | Ag | O |
|---|---|---|
| Rem. | 0.1 | 0.001max |
The physical properties of 10AOFC are as follows.
| Property | Typical value |
|---|---|
| Specific Gravity (293K) | 8.94 |
| Coefficient of Thermal Expansion (×10-6/K:293~573K) |
17.3 |
| Thermal Conductivity (W/(m・K):293K) |
388 |
| Volume Resistivity (μΩm:293K) |
0.0172 |
| Electrical Conductivity (%IACS:293K) |
100 |
| Modulus of Elasticity(kN/mm²:293K) | 117 |
The mechanical properties of 10AOFC are as follows.
| Typical value | |
|---|---|
| Tensile Strength (N/mm²) |
275 |
| Elongation (%) |
33 |