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  • High conductivity copper alloy

    C151

    C15100

    • High current
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    Main applications

    C151:Non‑magnetic IC lead frame, lead frame for transistor, various semiconductor package heat sink, and the like Automotive terminals · connectors, junction boxes, bus bars, conductive parts requiring high current

    • plate
    • strip
    • bar
    • wire
    • ball

    C151 is suitable for high power lead frames due to the excellent balance of electrical conductivity, strength and heat resistance.

    C151S

    Positioning map

    C151 is a copper alloy obtained by adding 0.1% of zirconium to pure copper. It succeeded in improving strength and heat resistance while maintaining high conductivity with a simple component.

    Bus bar
    High voltage connector
    connector for High voltage harness

    Main features

    1. High electrical conductivity and thermal conductivity
    2. 20% higher strength compared with pure copper
    3. Excellent heat resistance
    4. Nonmagnetic
    5. Possible to process reflow-Sn plating with excellent surface quality and whisker resistance

    Chemical composition

    (Weight %)

    Zr Cu
    0.1 Rem.
    * Including inevitable impurities and trace additive elements
    Technical Data

    Physical properties

    Property Representative Value
    Specific Gravity(293K) 8.9
    Coefficient of Thermal Expansion
    (×10-6/K:293~573K)
    17.7
    Thermal Conductivity
    (W/(m・K):293K)
    360
    Volume Resistivity
    (μΩm:293K)
    0.018
    Electrical Conductivity(%IACS:293K) 95
    Modulus of Elasticity(kN/mm²:293K) 121
    C151S

    C151S

    C151S has an excellence balance of strength, an excellence conductivity and heat resistance. An excellence we can provide those properties by our original technology.

    Positioning of Alloy

    C151S has higher strength than C151

    Bus bar
    High voltage connector
    connector for High voltage harness

    Main features

    1. High conductivity with simple component system
    2. Enhanced strength and stress relaxation characteristics by improving the manufacturing process
    3. Contributing to miniaturization of electronic components and lower heat generation
    4. Possible to process reflow-Sn plating with excellent surface quality and whisker resistance

    Chemical composition

    The chemical components of C151S are as follows.
    Excellent conductivity is exhibited with a simple component.

    (Weight %)

    Zr Cu
    0.1 Rem.
    * Including inevitable impurities and trace additive elements

    Physical properties

    The physical properties of C151S are as follows.

    Property Representative Value
    Specific Gravity (293K) 8.9
    Coefficient of Thermal Expansion
    (×10-6/K:293~573K)
    17.7
    Thermal Conductivity
    (W/(m・K):293K)
    347
    Volume Resistivity
    (μΩm:293K)
    0.020
    Electrical Conductivity(%IACS:293K) 88
    Modulus of Elasticity(kN/mm²:293K) 121

    Stress relaxation resistance

    C151S has the high stress relaxation characteristics that contribute to the compactness and weight reduction of electrical components (junction boxes, and the like) for recent hybrid vehicles, EV cars, and the like which require the high current.

    Exposure temperature: 150℃
    Sampling direction: Parallel to the rolling direction
    Bending stress: 80% of 0.2% yield strength

Leaflet download

C151SPDF ALLOY GUIDE(Plate/Strip)PDF