High-strength and heat-resistant oxygen-free copper
MOFC™-HR
C10850
- Thermal management
- High current
- Material-saving and miniaturization
MOFC-HR is an oxygen-free copper with strength and heat resistance enhanced to the world’s highest level, suitable for heat dissipating, high current electronic devices and conductors for EV, data center, AI and next generation energy applications. It is also a replacement material for copper alloys with low electrical conductivity.
Positioning map
It has the electrical and thermal conductivity of oxygen-free copper (C10200) with high strength, superior heat resistance, stress relaxation resistance and blanking workability.
Main features
- Equivalent electrical and thermal conductivity as C10200.
- Higher strength and blanking workability compared to C10200, available in EH and SH temper.
- High heat resistance applicable for high temperature environment.
- Superior stress relaxation resistance property offering high reliability.
- The above characteristics enable cost reductions through material savings, as well as miniaturization and weight reductions.
Chemical composition
The chemical compositions of MOFC-HR is as follows.
(mass %)
| Cu |
|---|
| 99.96 Min.* |
Technical Data
Physical properties
The physical properties of MOFC-HR is as follows.
| Property | Representative Value |
|---|---|
| Specific Gravity | 8.94 |
| Coefficient of Thermal Expansion ×10-6/K（20～300℃） |
17.7 |
| Thermal Conductivity W/(m・K)（20℃） |
391 |
| Volume ResistivityμΩm | 0.017 |
| Electrical Conductivity（%IACS） | 101 |
| Modulus of Elasticity（kN/mm²） | 119 |
| Poisson's ratio（293K） | 0.31 |
Mechanical properties
The mechanical properties of MOFC-HR is as follows.
| Temper | Typical values | |||||||
|---|---|---|---|---|---|---|---|---|
| 1/2H | H | EH | SH | 1/2H t:0.25mm |
H t:1.0mm |
EH t:1.2mm |
SH t:0.2mm |
|
| Tensile Strength (N/mm²) |
245～315 | 275～345 | 315～415 | 355～455 | 283 | 302 | 356 | 403 |
| 0.2% Yield Strength (N/mm²) |
- | - | - | - | 274 | 300 | 351 | 389 |
| Elongation (%) |
8Min. | - | - | - | 13 | 13 | 4 | 4 |
| Vickers Hardness※ (HV) |
(60～100) | (85～125) | (95～135) | (105～145) | 90 | 102 | 113 | 123 |
Blanking workability
The reduction of rollover and burr allows for higher dimensional accuracy compared to
C10200.
The end face after blanking is sharp and uniform without coarse inclusions.
Heat resistance
The heat resistance of MOFC-HR is shown on the right.
MOFC-HR can be used in high heat manufacturing process and high heat environment.
Stress relaxation resistance
The stress relaxation resistance of MOFC-HR is shown on the right.
MOFC-HR has the electrical conductivity of oxygen-free copper with superior heat
resistance, suitable for high voltage terminals and components requiring spring property.
Fatigue properties
MOFC-HR is suitable for use as a material for items that require vibration resistance, since it can be used numerous cycles before breaking.
Bendability
The bendability of MOFC-HR is as follows.
Excellent bendability, suitable for high voltage
terminals and busbars.
90° W-Bend, Specimen width=10mm, Load=9.8kN
| Temper | Sampling direction (to the L.D.) |
Bending radius (mm) R | R/t | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0.0 | 0.1 | 0.2 | 0.25 | 0.4 | 0.6 | 1.0 | 1.6 | 2.0 | 3.0 | |||
| 1/2H t:3.0mm |
0°：Good Way | △ | △ | △ | △ | △ | △ | ○ | ○ | ○ | ○ | 0.0 |
| 90°：Bad Way | △ | △ | △ | △ | △ | △ | ○ | ○ | ○ | ○ | 0.0 | |
| H t:1.0mm |
0°：Good Way | ○ | ○ | ○ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | 0.0 |
| 90°：Bad Way | ○ | ○ | ○ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | 0.0 | |
Cost savings due to material cross-sectional area reduction
Using MOFC-HR allows for a reduction in material cross-sectional area compared to
conventional alloy and C10200.
The improvement in performance also leads to material saving, cost saving, and product
miniaturization and weight reduction.
