Multi-gauge strips are used as electronic materials and terminal materials like lead frame for
power IC or high current terminal material because of their conductivity and heat dissipation
properties of a thick plate portion as well as workability of a thin plate portion.
The more the demand for high conductivity increases, the demand for this items as well will be
expected to grow.
Main features
Lead frame for semiconductor (power transistor)
- The heat dissipation portion and the lead portion of the transistor can be formed of the
same materials and can be simultaneously molded.
⇒Realize reduction in manufacturing management, reduction in assembly steps, and reduction in size
Applications for terminals and connectors
- High contact pressure can be obtained with less material.
- Thick portions contribute heat dissipation for high current applications.
- Contact pressure can be raised by using the rigidity of the thick portion.
What is Multi-gauge strip?
A stepped portion consisting of a thick portion and a thin section.
Technical Data
Available Dimensions
Product cross section
| site | available range | dimensional tolerance |
|---|---|---|
| T | ≤3.0mm | ±0.02 |
| t | 0.2mm≤ | ±0.02 |
| T/t | ≤5 | - |
| θ | 3°≤ | ±2 |
| Wc | ≤40mm | ±0.05 |
| W | ≤150mm | ±0.1 |
| |A-B| | - | ±0.2 |
| Mountain width | 0.8～42.0 | ±0.05 |
| Groove width | 0.3～0.51 | ±0.03 |
| Groove depth | 0.3～0.45 | ±0.03 |
| Warpage | ≤0.5mm | |
| Bending | ≤1.0/1000mm | |
| Burrs | ≤0.04mm | |
| Inner diameter of coil | Φ400mm | |
| Outer diameter of coil | ≤Φ1500mm | |