MITSUBISHI MATERIALSCopper & Copper Alloy Products

MITSUBISHI MATERIALSCopper & Copper Alloy Products

Japanese

Products information

Copper anode (balls)

Characteristics

High Purity ; Based on Mitsubishi oxygen free copper
Fine Grain ; Uniform and microstructure
Good Surface ; Oil-Free surface

  • Good dissolubility
  • Less sludge
  • Low contamination

Products Standard

  Class Content(ppm) Diameter(mmφ)
P O 11 27 40 45 55
Phosphorus copper anode (ball) DC 350~450 ≦20
DD 450~600 ≦20
Oxygen-free copper anode (ball) FF ≦10
Class Example of Analytical Value (ppm)
Cu P O S Fe Ni Zn Cd Mn Ag Pb Sn Sb Bi Te As Se
DD 99.94% 500 8 3 < 1 < 1 < 1 < 1 < 0.5 16 < 1 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 1
FF 99.99% < 1 5 3 < 1 < 1 < 1 < 1 < 0.5 17 < 1 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 1

Packing style

We deliver in lots of 20kg/Cardboard box, 1000kg, 1200kg/pallet.

Cardboard box(20kg)
※Packing example 1200kg plastic pallet

Product Use

  1. Printed circuit boards
  2. Decorative plating for automotive
  3. Rotogravure printing cylinders
  4. Raw materials for crucible melting

Copper anodes for semiconductors are available in a wide range of shapes.
Please feel free to contact us via this page for further details or inquiries.

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