MOFC-HR｜Copper & Copper Alloy Business Unit, MITSUBISHI MATERIALS

MOFC-HR is an oxygen-free copper with strength and heat resistance enhanced to the world’s highest level, suitable for heat dissipating, high current electronic devices and conductors for EV and next generation energy applications. It is also a replacement material for copper alloys with low electrical conductivity.

Positioning of Alloy

It has the electrical and thermal conductivity of oxygen-free copper (C10200) with high strength and superior heat resistance and stress relaxation resistance.

Main features

Equivalent electrical and thermal conductivity as C10200
Higher strength compared to C10200, available in EH and SH temper
High heat resistance applicable for high temperature environment
Superior stress relaxation resistance property offering high reliability
Suitable for heat dissipating, high current electronic devices and conductors

Main applications

High voltage terminals for automobiles, busbars, charging connectors, relay terminals and sockets, battery tab leads, lead frame and heat sink for power modules

Chemical composition

The chemical compositions of MOFC-HR are as follows.

(mass%)

Cu
99.96 Min.*

* Including inevitable impurities and trace additive elements.

Physical properties

The physical properties of MOFC-HR are as follows.

Property	Representative Value
Specific Gravity (297K)	8.94
Coefficient of Thermal Expansion (×10^-6/K : 293〜573 K)	17.7
Thermal Conductivity (W/(m・K) : 293 K)	391
Volume Resistivity (µΩm)	0.017
Electrical Conductivity (%IACS : 293 K)	101
Modulus of Elasticity (kN/mm² : 293 K)	119

Mechanical properties

The mechanical properties of MOFC-HR are as follows.

	Temper				Typical Values
	1/2H	H	EH	SH	1/2H t:3.0mm	H t:1.0mm	EH t:1.2mm	SH t:0.2mm
Tensile Strength (N/mm²)	245～315	275～345	315～415	355～455	246	302	356	403
0.2% Yield Strength (N/mm²)	-	-	-	-	226	300	351	389
Elongation (%)	15 Min.	-	-	-	38	13	4	4
Vickers Hardness^*1 (HV)	(60～100)	(85～125)	(95～135)	(105～145)	81	102	113	123

*1 Reference value

Heat Resistance

The heat resistance of MOFC-HR are shown on the right.
MOFC-HR can be used in high heat manufacturing process and high heat environment.

Stress relaxation resistance

The stress relaxation resistance of MOFC-HR are shown on the right.
MOFC-HR has the electrical conductivity of oxygen-free copper with superior heat resistance, suitable for high voltage terminals and components requiring spring property.

Bendability

The bendability of MOFC-HR is as follows.
Excellent bendability, suitable for high voltage terminals and busbars.

90° W-Bend, Specimen width=10mm, Load=9.8kN <JCBA T307>

Temper	Sampling direction (to the L.D.)	Bending radius (mm) R										R/t
Temper	Sampling direction (to the L.D.)	0.0	0.1	0.2	0.25	0.4	0.6	1.0	1.6	2.0	3.0	R/t
1/2H t:3.0mm	0°：Good Way	△	△	△	△	△	△	○	○	○	○	0.0
1/2H t:3.0mm	90°：Bad Way	△	△	△	△	△	△	○	○	○	○	0.0
H t:1.0mm	0°：Good Way	○	○	○	◎	◎	◎	◎	◎	◎	◎	0.0
H t:1.0mm	90°：Bad Way	○	○	○	◎	◎	◎	◎	◎	◎	◎	0.0

Criteria of evaluation: ◎Good (Acceptance), ○Minor rough surface (Acceptance), △Major rough surface (Acceptance),
▲Minor crack (Rejection), ×Major crack (Rejection)

Copper & Copper Alloy Business

Copper & Copper Alloy Business

Products information

MOFC-HR