New High-Strength Copper Alloy MSP™5-ESH Developed
- World-class Cu-Mg alloy to replace beryllium copper and titanium copper -

Integration of Western Japan Production Bases in the Copper & Copper Alloy Business
- Strengthening business value chain and accelerating business growth -

Developed MOFC-GC (Grain Control) Oxygen-Free Copper with World-Class Crystal Grain Growth Inhibition Performance
- Fine and uniform crystal structure maintained after heat treatment even at 1000℃ -

Establishment of a "Post-Stamping Plating" System for PIC plating® of Automotive Connector Terminals