C151 (High conductivity copper alloy)｜Copper & Copper Alloy Business Unit, MITSUBISHI MATERIALS

Standard No.

CDA: C15100（C151,C151S）

C151

C151 is suitable for high power lead frames due to the excellent balance of electrical conductivity , strength and heat resistance .

Positioning of Alloy

C151 is a copper alloy obtained by adding 0.1% of zirconium to pure copper. It succeeded in improving strength and heat resistance while maintaining high conductivity with a simple component.

Main features

High electrical conductivity and thermal conductivity
20% higher strength compared with pure copper
Excellent heat resistance
Nonmagnetic
Possible to process reflow-Sn plating with excellent surface quality and whisker resistance

Main applications

IC lead frame, lead frame for transistor, various semiconductor package heat sink, and the like
Automotive terminals · connectors, junction boxes, bus bars, conductive parts requiring high current

Chemical composition

(Weight %)

Zr	Cu
0.1	Rem.

* Including inevitable impurities and trace additive elements

Physical properties

Property	Representative Value
Specific Gravity（293K）	8.9
Coefficient of Thermal Expansion (×10^-6/K：293～573K)	17.7
Thermal Conductivity （W/(m・K)：293K）	360
Volume Resistivity (μΩm：293K)	0.018
Electrical Conductivity（%IACS:293K）	95
Modulus of Elasticity（kN/mm^２:293K）	121

C151S

C151S has excellent balance of strength,electrical conductivity and heat resistance.We can provide the those properties by our original technology.

Positioning of Alloy

C151S has high strength than C151

Main features

High conductivity with simple component system
Enhanced strength and stress relaxation characteristics by improving the manufacturing process
Contributing to miniaturization of electronic components and lower heat generation

Main applications

Automotive terminals · connectors, junction boxes, bus bars, conductive parts requiring high current

Chemical composition

The chemical components of C151S are as follows.
Excellent conductivity is exhibited with a simple component.

（(Weight %)

Zr	Cu
0.1	Rem.

* Including inevitable impurities and trace additive elements

Physical properties

The physical properties of C151S are as follows.

Property	Representative Value
Specific Gravity (293K)	8.9
Coefficient of Thermal Expansion (×10^-6/K：293～573K)	17.7
Thermal Conductivity (W/(m・K)：293K）	347
Volume Resistivity (μΩm：293K)	0.020
Electrical Conductivity（%IACS:293K）	88
Modulus of Elasticity（kN/mm^２:293K）	121

Stress relaxation resistance

C151S has the high stress relaxation characteristics that contribute to the compactness and weight reduction of electrical components (junction boxes, and the like) for recent hybrid vehicles, EV cars, and the like which require the high current.

Exposure temperature: 150℃
Sampling direction: Parallel to the rolling direction
Bending stress: 80% of 0.2% yield strength

Copper & Copper Alloy Business

Copper & Copper Alloy Business

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