MITSUBISHI MATERIALSCopper & Copper Alloy Business

MITSUBISHI MATERIALSCopper & Copper Alloy Business

Japanese

Products information

Mitsubishi High-Purity Copper MOF®-6N8(Cu purity 99.99998%:6N8)

Main features

Mitsubishi High-Purity Copper MOF®-6N8(Cu purity 99.99998%:6N8)

Sputtering target material for Semiconductor
Bonding wire material
  • Mitsubishi High-Purity Copper MOF®-6N8 has 7N-class purity , and excellent flexibility and workability. This is widely used in the semiconductor field where requires miniaturization and high speed performances.
  • This material has superior low-temperature property exceeding RRR (Residual Resistivity Ratio) 3000, and has been adopted for special applications, for example, components for cryogenic refrigerator and materials for R&D in the field of space technology.
  • “D.U.C.C.®”, the wire conductor for high-end audio cables, has the controlled crystal structure and the minimized transmission loss.
  • We make any products such as discs, wire, blocks and various shapes that customers require. Please feel free to contact us.

Chemical composition

【Unit : mass ppm】

  Mn P S Fe Ni Zn As Se Ag Cd Sn Sb Te Pb Bi
CDA
C10100
<0.5 <3 <15 <10 <10 <1 <5 <3 <25 <1 <2 <4 <2 <5 <1
MOF®
-6N8)
<0.001 <0.001 0.01 0.01 0.001 <0.01 <0.01 <0.01 0.15 <0.01 <0.01 <0.002 <0.01 0.003 <0.001

Inquiry

Group Ⅰ, Extruded Product & Wire Rod Sales Dept.

TEL:+81-3-5252-5334

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