MOFC-HR is an oxygen-free copper with strength and heat resistance enhanced to the world’s highest level, suitable for heat dissipating, high current electronic devices and conductors for EV, data center, AI and next generation energy applications. It is also a replacement material for copper alloys with low electrical conductivity.
It has the electrical and thermal conductivity of oxygen-free copper (C10200) with high strength, superior heat resistance, stress relaxation resistance and blanking workability.
High voltage terminals for automobiles, power module components, data center heat dissipation components, relays, busbars, lead frames, charging connectors, battery tab leads, heat sinks, heat spreaders, cold plates, vapor chamber
The chemical compositions of MOFC-HR are as follows.
(mass%)
| Cu |
|---|
| 99.96 Min.* |
The physical properties of MOFC-HR are as follows.
| Property | Representative Value |
|---|---|
| Specific Gravity (297K) |
8.94 |
| Coefficient of Thermal Expansion (×10-6/K : 293〜573 K) |
17.7 |
| Thermal Conductivity (W/(m・K) : 293 K) |
391 |
| Volume Resistivity (µΩm) |
0.017 |
| Electrical Conductivity (%IACS : 293 K) |
101 |
| Modulus of Elasticity (kN/mm2 : 293 K) |
119 |
| Poisson's ratio (293 K) |
0.31 |
The mechanical properties of MOFC-HR are as follows.
| Temper | Typical Values | |||||||
|---|---|---|---|---|---|---|---|---|
| 1/2H | H | EH | SH | 1/2H t:0.25mm |
H t:1.0mm |
EH t:1.2mm |
SH t:0.2mm |
|
| Tensile Strength (N/mm2) |
245～315 | 275～345 | 315～415 | 355～455 | 283 | 302 | 356 | 403 |
| 0.2% Yield Strength (N/mm2) |
- | - | - | - | 274 | 300 | 351 | 389 |
| Elongation (%) |
8 Min. | - | - | - | 13 | 13 | 4 | 4 |
| Vickers Hardness*1 (HV) |
(60～100) | (85～125) | (95～135) | (105～145) | 90 | 102 | 113 | 123 |
The reduction of rollover and burr allows for higher dimensional accuracy compared to C10200.
The end face after blanking is sharp and uniform without coarse inclusions.
The heat resistance of MOFC-HR are shown on the right.
MOFC-HR can be used in high heat manufacturing process and high heat environment.
The stress relaxation resistance of MOFC-HR are shown on the right.
MOFC-HR has the electrical conductivity of oxygen-free copper with superior heat resistance, suitable for high voltage terminals and components requiring spring property.
MOFC-HR is suitable for use as a material for items that require vibration resistance, since it can be used numerous cycles before breaking.
The bendability of MOFC-HR is as follows.
Excellent bendability, suitable for high voltage terminals and busbars.
90° W-Bend, Specimen width=10mm, Load=9.8kN <JCBA T307>
| Temper | Sampling direction (to the L.D.) |
Bending radius (mm) R | R/t | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0.0 | 0.1 | 0.2 | 0.25 | 0.4 | 0.6 | 1.0 | 1.6 | 2.0 | 3.0 | |||
| 1/2H t:3.0mm |
0°：Good Way | △ | △ | △ | △ | △ | △ | ○ | ○ | ○ | ○ | 0.0 |
| 90°：Bad Way | △ | △ | △ | △ | △ | △ | ○ | ○ | ○ | ○ | 0.0 | |
| H t:1.0mm |
0°：Good Way | ○ | ○ | ○ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | 0.0 |
| 90°：Bad Way | ○ | ○ | ○ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | ◎ | 0.0 | |
Using MOFC-HR allows for a reduction in material cross-sectional area compared to conventional alloy and C10200.
The improvement in performance also leads to material saving, cost saving, and product miniaturization and weight reduction.
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