MITSUBISHI MATERIALSCopper & Copper Alloy Business

MITSUBISHI MATERIALSCopper & Copper Alloy Business

Japanese

Products information

MSP SeriesCu-Mg Copper Alloys

Standard No.
CDA
C18665(MSP1)CDA: C18670(MSP5)CDA: C18661(MSP8)

MSP Series of high-performance are solid solution strengthened Cu-Mg alloys. The lineup includes MSP1, which has been well received by customers and utilized for many years in electrical terminals for automotive applications, bus bars and relays; MSP5, which offers higher strength, bendability and low specific gravity making it ideal for use in compact-sized terminals; and MSP8, which offers superior electrical conductivity and excellent stress relaxation resistance that make it ideal for use in high-voltage, high-current applications such as bus bars and high-voltage terminals. In these ways, the series contributes to the advancement of electronics used in automobiles and other applications.

Positioning of alloys

MSP1 (CDA No:C18665)

MSP1 has been widely used as a copper alloy for terminals, and its stable quality, characteristics, and supply network make it preferred by many users. It is our No. 1 global alloy, for which we have obtained CDA No. and established a supply network in 3 regions (North America, Europe, Asia). MSP1 is also adopted for use in high-voltage terminals in EVs and PHEVs.

Positioning of alloy

MSP1 has been used for various parts such as connectors and busbars for automotive (ICE and xEV ) , moving contacts for relay , due to its excellent character, quality and supply network.
MSP1 is a global copper alloy with CDA No..
We can supply MSP1 to 3 regions(North America,Europe,Asia)

Main features

  1. Good electrical conductivity and strength
  2. Excellent stress relaxation resistance
  3. Excellent stress corrosion cracking resistance
  4. Excellent fatigue characteristics
  5. Conforms to Class JC300 of the Japan Automobile Standards Organization's standard (JASO D 620)
  6. Possible to process reflow-Sn plating with excellent surface quality and whisker resistance

Main applications

Terminals (for automotive applications), relays (moveable piece), spring materials for contacts, bus bars, breakers, battery terminals, fuse terminals, compact switches, electrical conductive parts in lithium ion batteries, junction boxes and relay boxes

Connectors for Automobile
High Voltage connectors
Connectors for high voltege harness
Busbar for junction box
Reray

Chemical composition

The chemical compositions of MSP1 are as follows.

(Weight %)

Mg P Cu
0.7 0.005 Rem.*
* Including inevitable impurities and trace additive elements.

Physical properties

The physical properties of MSP1 are as follows.

Property Representative Value
Specific Gravity
(297K)
8.8
Coefficient of Thermal Expansion
(×10-6/K : 293〜573 K)
17.3
Thermal Conductivity
(W/(m・K) : 293 K)
264
Volume Resistivity
(µΩm : 293 K)
0.027
Electrical Conductivity
(%IACS : 293 K)
63
Modulus of Elasticity
(kN/mm2 : 293 K)
125

Mechanical properties

The mechanical properties of MSP1 are as follows.

  Temper Typical value
1/4H 1/2H H EH SH 1/4H 1/2H H EH
Tensile Strength
(N/mm2)
365〜450 420〜510 480〜570 540〜630 590min. 399 459 530 585
0.2% Yield Strength
(N/mm2)
300〜410 370〜480 440〜550 490〜620 540min. 328 432 494 560
Elongation
(%)
15min. 10min. 7min. 5min. - 25 15 11 8
Elastic Limit*1
Kb0.1(N/mm2)
- - - - - (290) (349) (397) (424)
Vickers Hardness*2
(HV)
(90
〜140)
(120
〜170)
(150
〜190)
(170
〜210)
(180min.) (126) (144) (162) (178)
*1: Sampling direction perpendicular to the rolling direction
*1, 2: Reference values

Softening resistance

The Softening resistance of MSP1 is shown on the right.

MSP1 has sufficient Softening resistance for use as a terminal material, and as a spring material. It is especially suitable as an alternative to phosphor bronze.

Stress relaxation resistance

The stress relaxation resistance of MSP1 are shown on the right.

MSP1 has excellent stress relaxation resistance among copper alloys and has extremely high reliability as a terminal material

Exposure temperature: 150℃
Sampling direction: Parallel to the rolling direction
Bending stress: 80% of 0.2% yield strength

Bending workability

The bending workability of MSP1 is as follows.

MSP1 has not only an excellent balance of strength and conductivity, but also good bending workability, and can thus contribute to the miniaturization of various parts.

Temper Sampling direction
(to the rolling direction)
Bending Inside Radius (mm) R Evaluation
R/t
0.0 0.1 0.125 0.15 0.2 0.25 0.4 0.6 0.8 1.0
1/2H 0°:(Good way) 0.0
90°:(Bad way) 0.0
H 0°:(Good way) 0.0
90°:(Bad way) 0.3
EH 0°:(Good way) 0.0
90°:(Bad way) 0.8
Evaluation criteria:◎good (pass),○minor rough surface (pass),△rough surface (pass),▲minor cracking (fail),×major cracking (fail)

Fatigue characteristics

The fatigue characteristics of MSP1 are shown on the right.

MSP1 has excellent fatigue characteristics as a spring material, since it can be used numerous cycles before breaking.

MSP5 (CDA No:C18670)

MSP5 is the highest strength copper alloy in the MSP Series. Its combination of proper electrical conductivity, excellent stress relaxation resistance and bendability means that it is suitable for use as a terminal material for a diverse range of electronic and electrical devices where compact size is desired. In particular, it has been evaluated highly by customers as a copper alloy for compact-sized terminals for automotive applications. It is also suitable as an alternative to Corson alloys and phosphor bronze.

Positioning of alloy

MSP5 offers high strength, electrical conductivity and stress relaxation resistance that are the same as (or superior to) our Corson type alloys, while at the same time offering excellent bending and blanking workability.
It is a high-strength copper alloy that is suitable for use as terminal and spring materials, including automobile 0.50 terminals and other compact terminals for automotive and other industries.

Main features

  1. Excellent balance between yield strength and electrical conductivity.
  2. Excellent stress relaxation resistance, the same or better than those of Corson alloys
  3. Excellent bending formability for compact terminals (box-bending workability, blanking workability)
  4. Low specific gravity (95% that of Corson alloys) and offering excellent cost performance, due to free of rare metals
  5. Conforms to Class JC400 (temper 1/2H-EH) of the Japan Automobile Standards Organization's standard (JASO D 620)
  6. Possible to process reflow-Sn plating with excellent surface quality and whisker resistance, or PIC plating, offering low insertion/removal force

Main applications

Terminals (for automobiles and other industries), relays (moveable piece), spring materials for contacts

Connectors for Automobile

Chemical composition

The chemical compositions of MSP5 are as follows.

(Weight %)

Mg Cu
1.6 Rem.**
* Including inevitable impurities and trace additive elements.

Physical properties

The physical properties of MSP5 are as follows.

(Weight %)

Property Representative Value
Specific Gravity
(297K)
8.5
Coefficient of Thermal Expansion
(×10-6/K : 293〜573 K)
18.2
Thermal Conductivity
(W/(m・K) : 293 K)
174
Volume Resistivity
(µΩm : 293 K)
0.042
Electrical Conductivity
(%IACS : 293 K)
43
Modulus of Elasticity
(kN/mm2: 293 K)
115

Mechanical properties

The mechanical properties of MSP5 are as follows.

MSP5 has been designed with high strength to the perpendicular to the rolling direction, making it suitable for use in terminals for automotive applications.

(Weight %)

  Temper Typical value(LD/TD)
1/2H H EH SH 1/2H
0.64mm thickness
H
0.15mm thickness
EH
0.15mm thickness
SH
0.15mm thickness
Tensile Strength
(N/mm2)
485〜585 530〜630 575〜675 620〜720 543/565 593/645 625/695 677/780
0.2% Yield Strength
(N/mm2)
- - - - 507/512 543/592 585/647 636/735
Elongation
(%)
5min. 4min. 3min. 3min. 11/16 9/14 7/12 7/10
Elastic Limit*1
Kb0.1(N/mm2)
- - - - (524) (609) (712) (764)
Vickers Hardness*2
(HV)
(145
〜205)
(160
〜220)
(175
〜235)
(190
〜250)
(178) (193) (203) (219)
*1: Sampling direction perpendicular to the rolling direction
*1, 2: Reference values

Softening resistance

The Softening resistance of MSP5 is shown on the right.

MSP5 has sufficient Softening resistance for use as a terminal material, and as a spring material. It is also suitable as an alternative to phosphor bronze.

Stress relaxation resistance

The stress relaxation resistance of MSP5 are shown on the right.

MSP5 offers stress relaxation resistance that are the same as (or superior to) our Corson alloys, making it suitable for use as a terminal material for automotive and other industries.

Exposure temperature: 150℃
Sampling direction: Perpendicular to the rolling direction
Bending stress: 80% of 0.2% yield strength

Bendability

The bendability of MSP5 is as follows.

Temper Thickness
(mm)
Sampling direction
(to the rolling direction)
Bending Inside Radius (mm) R Evaluation
R/t
0.0 0.1 0.15 0.2 0.25 0.4 0.6
H 0.15 0°:(Good way) 0.0
90°:(Bad way) 0.7
EH 0.15 0°:(Good way) 0.0
90°:(Bad way) 1.0
Evaluation criteria:○minor rough surface (pass),△rough surface (pass),▲minor cracking (fail),×major cracking (fail)

The cross section of automobile 0.50 terminal are shown on the right.

MSP5 offers excellent box-bending workability, making it possible to form into automobile 0.5 terminals and other compact terminals for automotive and other industries.

Specific gravity related advantages

MSP5 has an approximately 5% lower specific gravity than pure copper and Corson alloys. This means that for the same weight, the length of the product is approximately 5% longer, and that many more terminals can be manufactured from the same weight of material.

Coil weight per 1mm width: 6kg/mm, 0.15t

MSP8 (CDA No:C18661)

MSP8 is the most suitable copper alloy for high-voltage and high-current applications in the MSP series. It offers high electrical conductivity (approximately 80% IACS) and excellent stress relaxation resistance, and is ideal for use as a material for bus bars and high-voltage terminals for next-generation automobiles.
It also has excellent press workability and high strength, enabling to form precise geometry.

Positioning of alloy

MSP8 offers high electrical conductivity (approximately 80% IACS) and excellent stress relaxation resistance, and has excellent press workability and high strength. It is a high conductive copper alloy that is ideal for use in high-voltage terminals for automotive applications and high-current bus bars.

Main features

  1. Excellent electrical conductivity and thermal conductivity (approximately 80% IACS)
  2. Excellent stress relaxation resistance
  3. Excellent press workability and high material strength
  4. Excellent bendability
  5. Conforms to Class JC100 (temper 1/4H-H) and JC300 (EH) of the Japan Automobile Standards Organization's standard (JASO D 620)
  6. Possible to process reflow-Sn plating with excellent surface quality and whisker resistance, or PIC plating, offering low insertion/removal force

Main applications

Terminals (for automotive applications), bus bars, charging connectors, relays (moveable piece), spring materials for contacts, electrical conductive parts in junction boxes, relay boxes

Busbar for junction box
Busbar
High Voltage connectors
Connectors for high voltege harness

Chemical composition

The chemical compositions of MSP8 are as follows.

(Weight %)

Mg P Cu
0.25 0.002 Rem.*
* Including inevitable impurities and trace additive elements.

Physical properties

The physical properties of MSP8 are as follows.

Property Representative Value
Specific Gravity
(297K)
8.9
Coefficient of Thermal Expansion
(×10-6/K : 293〜573 K)
17.8
Thermal Conductivity
(W/(m・K) : 293 K)
340
Volume Resistivity
(µΩm : 293 K)
0.021
Electrical Conductivity
(%IACS : 293 K)
82
Modulus of Elasticity
(kN/mm2: 293 K)
131

Mechanical properties

The mechanical properties of MSP8 are as follows.

  Temper Typical value
1/4H 1/2H H EH 1/4H
3.0㎜ thickness
1/2H
0.4㎜ thickness
H
0.8㎜ thickness
EH
0.64㎜ thickness
Tensile Strength
(N/mm2)
270〜370 320〜420 360〜460 420〜520 325 367 415 459
0.2% Yield Strength
(N/mm2)
- - - - 282 331 399 434
Elongation
(%)
10min. 6min. 3min. 2min. 17 16 9 9
Elastic Limit*1
Kb0.1(N/mm2)
- - - - - (334) (357) (384)
Vickers Hardness*2
(HV)
(70
〜130)
(85
〜145)
(100
〜160)
(110
〜170)
(102) (113) (130) (141)
*1: Sampling direction perpendicular to the rolling direction
*1, 2: Reference values

Softening resistance

The Softening resistance of MSP8 is shown on the right.

MSP8 has sufficient Softening resistance for use as a terminal material, and as a spring material.

Stress relaxation resistance

The stress relaxation resistance of MSP8 are shown on the right.

MSP8 has both high electrical conductivity and excellent stress relaxation resistance, making it appropriate for use in high-voltage terminals and bus bars.

Exposure temperature: 150℃
Sampling direction: Parallel to the rolling direction
Bending stress: 80% of 0.2% yield strength

Bendability

The bendability of MSP8 is as follows. MSP8 offers good bendability and is therefore suitable for high-voltage terminals and bus bars which require a high level of dimensional precision.

Temper Thickness
(mm)
Sampling direction
(to the rolling direction)
Bending Inside Radius (mm) R Evaluation
R/t
0.0 0.1 0.2 0.25 0.4 0.6 1.0 1.6 2.0 3.0
1/2H 0.4 0°:(Good way) 0.3
90°:(Bad way) 0.0
H 0.64 0°:(Good way) 0.4
90°:(Bad way) × × 0.6
EH 0.64 0°:(Good way) 0.6
90°:(Bad way) × × × 0.9
Evaluation criteria:◎good (pass),○minor rough surface (pass),△rough surface (pass),▲minor cracking (fail),×major cracking (fail)

Fatigue characteristics

The fatigue characteristics of MSP8 are shown on the right.

MSP8 is suitable for use as a material for relays (moveable part) and springs, since it can be used numerous cycles before breaking.

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