MITSUBISHI MATERIALSCopper & Copper Alloy Business

MITSUBISHI MATERIALSCopper & Copper Alloy Business

Japanese

Products information

ZCCu-Zr alloy

Standard No.
CDA
C15150

Highly heat resistant copper alloy for lead frame with high conductivity of oxygen-free copper class

Positioning of Alloy

It is used for power semiconductors such as olead frames and heat sinks with copper alloys with the same conductivity as that of copper and excellent strength and heat resistance.

Main features

  1. Very good electric and thermal conductivity (conductivity%, IACS average)
  2. Excellent strength as compared with pure copper
  3. Excellent heat resistance
  4. Nonmagnetic
  5. Possible to process reflow-Sn plating with excellent surface quality and whisker resistance

Main applications

Heat sinks for various semiconductor package, lead frame for transistor, lead frame for IC, and the like

Lead frame
Heat sink

Chemical composition

The chemical components of ZC are as follows.

(Weight %)

Zr Cu
0.02 Rem.
* Including inevitable impurities and trace additive elements

Physical properties

The physical properties of ZC are as follows.

Property Representative Value
Specific Gravity (293K) 8.9
Coefficient of Thermal Expansion
(×10-6/K:293~573K)
17.7
Thermal Conductivity
(W/(m・K):293K)
373
Volume Resistivity
(μΩm:293K)
0.018
Electrical Conductivity
(%IACS:293K)
97
Modulus of Elasticity
(kN/mm2: 293K)
121

Mechanical properties (Sampling direction:L.D.)

Mechanical properties of ZC are as follows.
ZC has strength exceeding that of pure copper as required characteristic for lead frame application.

  Temper
1/2H H EH SH
Tensile Strength
(N/mm2)
245~295 295~355 355~410 410~470
Elongation
(%)
6 4 2 2
Vickers Hardness*
(HV)
(75~110) (100~120) (110~130) (125min.)
* For reference

Softing resistance

It corresponds to energization heat generation for high current semiconductor device applications and shows the heat resistance higher than pure copper.

Inquiry

Rolled product Sales Dept.

TEL:+81-3-5252-4981

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